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Journal: Micromachines, 2022
Volume: 13
Number: 1191
Article:
Hermetic Packaging Based on Cu–Sn and Au–Au Dual Bonding for High-Temperature Graphene Pressure Sensor
Authors:
by
Junqiang Wang, Haikun Zhang, Xuwen Chen and Mengwei Li
Link:
https://www.mdpi.com/2072-666X/13/8/1191
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