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Journal: Micromachines, 2022
Volume: 13
Number: 1178

Article: Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures
Authors: by Ole Behrmann, Thomas Lisec and Björn Gojdka
Link: https://www.mdpi.com/2072-666X/13/8/1178

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