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Kim H, Lee S, Song K, Shin Y, Park D, Park J, Cho J, Ahn S. A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory. Micromachines. 2022; 13(7):1070. https://doi.org/10.3390/mi13071070

Kim, Hyunwoong, Seonghi Lee, Kyunghwan Song, Yujun Shin, Dongyrul Park, Jongcheol Park, Jaeyong Cho, and Seungyoung Ahn. 2022. "A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory" Micromachines 13, no. 7: 1070. https://doi.org/10.3390/mi13071070

Kim, H., Lee, S., Song, K., Shin, Y., Park, D., Park, J., Cho, J., & Ahn, S. (2022). A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory. Micromachines, 13(7), 1070. https://doi.org/10.3390/mi13071070