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Journal: Micromachines, 2022
Volume: 13
Number: 1011

Article: Precision Layered Stealth Dicing of SiC Wafers by Ultrafast Lasers
Authors: by Bo Yang, Heng Wang, Sheng Peng and Qiang Cao
Link: https://www.mdpi.com/2072-666X/13/7/1011

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