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Journal: Micromachines, 2022
Volume: 13
Number: 953

Article: Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints
Authors: by Yuanxiang Zhang, Jicheng Zhang, Yong Wang and Yike Fang
Link: https://www.mdpi.com/2072-666X/13/6/953

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