Zhang, Y.; Wang, S.; Dong, F.; Sun, Y.; Sheng, C.; Ma, K.; Tian, Z.; Qian, Z.; Wong, C.; Liu, S.
Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices. Micromachines 2022, 13, 301.
https://doi.org/10.3390/mi13020301
AMA Style
Zhang Y, Wang S, Dong F, Sun Y, Sheng C, Ma K, Tian Z, Qian Z, Wong C, Liu S.
Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices. Micromachines. 2022; 13(2):301.
https://doi.org/10.3390/mi13020301
Chicago/Turabian Style
Zhang, Yuexin, Shizhao Wang, Fang Dong, Yameng Sun, Can Sheng, Kun Ma, Zhiqiang Tian, Zhengfang Qian, Chingping Wong, and Sheng Liu.
2022. "Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices" Micromachines 13, no. 2: 301.
https://doi.org/10.3390/mi13020301
APA Style
Zhang, Y., Wang, S., Dong, F., Sun, Y., Sheng, C., Ma, K., Tian, Z., Qian, Z., Wong, C., & Liu, S.
(2022). Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices. Micromachines, 13(2), 301.
https://doi.org/10.3390/mi13020301