Tian, W.; Li, B.; Li, Z.; Cui, H.; Shi, J.; Wang, Y.; Zhao, J.
Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions. Micromachines 2022, 13, 1790.
https://doi.org/10.3390/mi13101790
AMA Style
Tian W, Li B, Li Z, Cui H, Shi J, Wang Y, Zhao J.
Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions. Micromachines. 2022; 13(10):1790.
https://doi.org/10.3390/mi13101790
Chicago/Turabian Style
Tian, Wenchao, Bin Li, Zhao Li, Hao Cui, Jing Shi, Yongkun Wang, and Jingrong Zhao.
2022. "Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions" Micromachines 13, no. 10: 1790.
https://doi.org/10.3390/mi13101790
APA Style
Tian, W., Li, B., Li, Z., Cui, H., Shi, J., Wang, Y., & Zhao, J.
(2022). Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions. Micromachines, 13(10), 1790.
https://doi.org/10.3390/mi13101790