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Journal: Micromachines, 2022
Volume: 13
Number: 1704

Article: Effects of Moisture Diffusion on a System-in-Package Module by Moisture–Thermal–Mechanical-Coupled Finite Element Modeling
Authors: by Zhiwen Chen, Zheng Feng, Meng Ruan, Guoliang Xu and Li Liu
Link: https://www.mdpi.com/2072-666X/13/10/1704

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