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Journal: Micromachines, 2022
Volume: 13
Number: 1704
Article:
Effects of Moisture Diffusion on a System-in-Package Module by Moisture–Thermal–Mechanical-Coupled Finite Element Modeling
Authors:
by
Zhiwen Chen, Zheng Feng, Meng Ruan, Guoliang Xu and Li Liu
Link:
https://www.mdpi.com/2072-666X/13/10/1704
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