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Journal: Micromachines, 2021
Volume: 12
Number: 946

Article: Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G
Authors: by Zhihao Ren, Jikai Xu, Xianhao Le and Chengkuo Lee
Link: https://www.mdpi.com/2072-666X/12/8/946

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