Next Article in Journal
Physics-Based TCAD Simulation and Calibration of 600 V GaN/AlGaN/GaN Device Characteristics and Analysis of Interface Traps
Next Article in Special Issue
Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation
Previous Article in Journal
Cystic Fibrosis Human Organs-on-a-Chip
Previous Article in Special Issue
Study of the Absorption of Electromagnetic Radiation by 3D, Vacuum-Packaged, Nano-Machined CMOS Transistors for Uncooled IR Sensing
 
 

Order Article Reprints

Journal: Micromachines, 2021
Volume: 12
Number: 750

Article: Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments
Authors: by Jun-Hao Lee, Pin-Kuan Li, Hai-Wen Hung, Wallace Chuang, Eckart Schellkes, Kiyokazu Yasuda and Jenn-Ming Song
Link: https://www.mdpi.com/2072-666X/12/7/750

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop