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Journal: Micromachines, 2021
Volume: 12
Number: 516

Article: Wafer-Bonding Fabricated CMUT Device with Parylene Coating
Authors: by Changde He, Binzhen Zhang, Chenyang Xue, Wendong Zhang and Shengdong Zhang
Link: https://www.mdpi.com/2072-666X/12/5/516

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