Wu, Z.; Zhang, S.; Liu, Z.; Lu, C.; Hu, Z.
Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures. Micromachines 2021, 12, 480.
https://doi.org/10.3390/mi12050480
AMA Style
Wu Z, Zhang S, Liu Z, Lu C, Hu Z.
Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures. Micromachines. 2021; 12(5):480.
https://doi.org/10.3390/mi12050480
Chicago/Turabian Style
Wu, Zhenhua, Shuai Zhang, Zekun Liu, Cheng Lu, and Zhiyu Hu.
2021. "Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures" Micromachines 12, no. 5: 480.
https://doi.org/10.3390/mi12050480
APA Style
Wu, Z., Zhang, S., Liu, Z., Lu, C., & Hu, Z.
(2021). Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures. Micromachines, 12(5), 480.
https://doi.org/10.3390/mi12050480