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Journal: Micromachines, 2021
Volume: 12
Number: 429

Article: The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw
Authors: by Tengyun Liu, Peiqi Ge and Wenbo Bi
Link: https://www.mdpi.com/2072-666X/12/4/429

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