Wang, M.;                     Ma, S.;                     Jin, Y.;                     Wang, W.;                     Chen, J.;                     Hu, L.;                     He, S.    
        A RF Redundant TSV Interconnection for High Resistance Si Interposer. Micromachines 2021, 12, 169.
    https://doi.org/10.3390/mi12020169
    AMA Style
    
                                Wang M,                                 Ma S,                                 Jin Y,                                 Wang W,                                 Chen J,                                 Hu L,                                 He S.        
                A RF Redundant TSV Interconnection for High Resistance Si Interposer. Micromachines. 2021; 12(2):169.
        https://doi.org/10.3390/mi12020169
    
    Chicago/Turabian Style
    
                                Wang, Mengcheng,                                 Shenglin Ma,                                 Yufeng Jin,                                 Wei Wang,                                 Jing Chen,                                 Liulin Hu,                                 and Shuwei He.        
                2021. "A RF Redundant TSV Interconnection for High Resistance Si Interposer" Micromachines 12, no. 2: 169.
        https://doi.org/10.3390/mi12020169
    
    APA Style
    
                                Wang, M.,                                 Ma, S.,                                 Jin, Y.,                                 Wang, W.,                                 Chen, J.,                                 Hu, L.,                                 & He, S.        
        
        (2021). A RF Redundant TSV Interconnection for High Resistance Si Interposer. Micromachines, 12(2), 169.
        https://doi.org/10.3390/mi12020169