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Journal: Micromachines, 2021
Volume: 12
Number: 1157
Article:
Optimization of Copper Electroforming Process Parameters Based on Double Hidden Layer BP Neural Network
Authors:
by
Feng Ji, Chao Chen, Yongfei Zhao and Byungwon Min
Link:
https://www.mdpi.com/2072-666X/12/10/1157
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