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Article

Electrowetting-on-Dielectric Based Economical Digital Microfluidic Chip on Flexible Substrate by Inkjet Printing

by 1,2 and 1,*
1
Robotics and Microsystems Center, Soochow University, Soochow 215006, China
2
School of Mechanical Engineering, Henan University of Engineering, Zhengzhou 451191, China
*
Author to whom correspondence should be addressed.
Micromachines 2020, 11(12), 1113; https://doi.org/10.3390/mi11121113
Received: 27 November 2020 / Revised: 13 December 2020 / Accepted: 14 December 2020 / Published: 16 December 2020
(This article belongs to the Special Issue Droplet-Based Microfluidic Devices)
In order to get rid of the dependence on expensive photolithography technology and related facilities, an economic and simple design and fabrication technology for digital microfluidics (DMF) is proposed. The electrodes pattern was generated by inkjet printing nanosilver conductive ink on the flexible Polyethylene terephthalate (PET) substrate with a 3D circuit board printer, food wrap film was attached to the electrode array to act as the dielectric layer and Teflon® AF was sprayed to form a hydrophobic layer. The PET substrate and food wrap film are low cost and accessible to general users. The proposed flexible DMF chips can be reused for a long time by replacing the dielectric film coated with hydrophobic layer. The resolution and conductivity of silver traces and the contact angle and velocity of the droplets were evaluated to demonstrate that the proposed technology is comparable to the traditional DMF fabrication process. As far as the rapid prototyping of DMF is concerned, this technology has shown very attractive advantages in many aspects, such as fabrication cost, fabrication time, material selection and mass production capacity, without sacrificing the performance of DMF. The flexible DMF chips have successfully implemented basic droplet operations on a square and hexagon electrode array. View Full-Text
Keywords: digital microfluidics; electrowetting-on-dielectric; inkjet printing; flexible substrate; dielectric wrap film; hexagon electrode digital microfluidics; electrowetting-on-dielectric; inkjet printing; flexible substrate; dielectric wrap film; hexagon electrode
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MDPI and ACS Style

Wang, H.; Chen, L. Electrowetting-on-Dielectric Based Economical Digital Microfluidic Chip on Flexible Substrate by Inkjet Printing. Micromachines 2020, 11, 1113. https://doi.org/10.3390/mi11121113

AMA Style

Wang H, Chen L. Electrowetting-on-Dielectric Based Economical Digital Microfluidic Chip on Flexible Substrate by Inkjet Printing. Micromachines. 2020; 11(12):1113. https://doi.org/10.3390/mi11121113

Chicago/Turabian Style

Wang, He, and Liguo Chen. 2020. "Electrowetting-on-Dielectric Based Economical Digital Microfluidic Chip on Flexible Substrate by Inkjet Printing" Micromachines 11, no. 12: 1113. https://doi.org/10.3390/mi11121113

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