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World Electric Vehicle Journal is published by MDPI from Volume 9 issue 1 (2018). Articles in this Issue were published by The World Electric Vehicle Association (WEVA) and its member the European Association for e-Mobility (AVERE), the Electric Drive Transportation Association (EDTA), and the Electric Vehicle Association of Asia Pacific (EVAAP). They are hosted by MDPI on mdpi.com as a courtesy and upon agreement with AVERE.
Open AccessArticle

Power semiconductor and packaging trends in vehicle electrification

Infineon Technologies Korea, Seoul, South Korea
World Electr. Veh. J. 2015, 7(2), 250-260; https://doi.org/10.3390/wevj7020250
Published: 26 June 2015
PDF [1026 KB, uploaded 18 May 2018]

Abstract

Since road traffic currently contributes 23% to CO2 emission, the European Union forces car makers to reduce the average CO2 emission of their fleet to 95g CO2/km by 2021. This can only be achieved by electrification of vehicles. It is obvious that the market requires electrified vehicles to be comparable to combustion engine cars in price, driving range, maintenance effort, lifetime and safety. The main inverter, also called HPCU (hybrid control unit), with the power module as its core component plays a key role because it is a major lever for CO2 reduction. The strict rules of the EC requires future power modules with highest power density, high voltage and high current rating, high temperature capability and cooling, sufficient lifetime, low weight and small size. The article describes how Infineon will meet the requirements of power modules for the coming years. On the power semiconductor technology side, a new IGBT generation will be introduced as well as a very thin IGBT technology. On the packaging side, two new packages will be introduced: a very compact low-cost generator module, and a high power motor module with significant improvements in power density and size, cost, stray inductance and efficiency. It will also be discussed how to further increase the robustness of such packages to allow operation at even higher operating temperatures. An insight into wide bandgap power semiconductor switches will also be given. The new technologies will reduce Vce and switching losses at the same time and thereby increase inverter efficiency and power density.
Keywords: (Hybrid) Electric vehicle; IGBT module; HybridPACK; power density; SiC; GaN (Hybrid) Electric vehicle; IGBT module; HybridPACK; power density; SiC; GaN
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Strass, A. Power semiconductor and packaging trends in vehicle electrification. World Electr. Veh. J. 2015, 7, 250-260.

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