Article Versions Notes

Shi Y, Lv M, Lu G, Hui C, He L, Chen X, Chen Y, Lu X. Characteristics of 3D-Integrated GaN Power Module Under Multi Heat Source Coupling. Materials. 2025; 18(5):1082. https://doi.org/10.3390/ma18051082

Shi, Yijun, Mingen Lv, Guoguang Lu, Caixing Hui, Liang He, Xinghuan Chen, Yuan Chen, and Xiangjun Lu. 2025. "Characteristics of 3D-Integrated GaN Power Module Under Multi Heat Source Coupling" Materials 18, no. 5: 1082. https://doi.org/10.3390/ma18051082

Shi, Y., Lv, M., Lu, G., Hui, C., He, L., Chen, X., Chen, Y., & Lu, X. (2025). Characteristics of 3D-Integrated GaN Power Module Under Multi Heat Source Coupling. Materials, 18(5), 1082. https://doi.org/10.3390/ma18051082