Wang, Z.; Chen, J.; Huang, Y.; Zong, Y.; Xing, S.; Wu, J.; Wu, X.; Dong, P.; Xia, R.; Wang, X.;
et al. Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing. Materials 2025, 18, 865.
https://doi.org/10.3390/ma18040865
AMA Style
Wang Z, Chen J, Huang Y, Zong Y, Xing S, Wu J, Wu X, Dong P, Xia R, Wang X,
et al. Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing. Materials. 2025; 18(4):865.
https://doi.org/10.3390/ma18040865
Chicago/Turabian Style
Wang, Zheng, Jinfang Chen, Yawei Huang, Yue Zong, Shuai Xing, Jiani Wu, Xiaowei Wu, Pengcheng Dong, Runzhi Xia, Xiaohu Wang,
and et al. 2025. "Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing" Materials 18, no. 4: 865.
https://doi.org/10.3390/ma18040865
APA Style
Wang, Z., Chen, J., Huang, Y., Zong, Y., Xing, S., Wu, J., Wu, X., Dong, P., Xia, R., Wang, X., He, X., Zhao, M., Chen, Z., Liu, X., & Wang, D.
(2025). Mechanism of Pit Formation on Surface of Superconducting Niobium Cavities During Buffered Chemical Polishing. Materials, 18(4), 865.
https://doi.org/10.3390/ma18040865
