Lv, X.; Zhang, C.; Liu, Y.; Pan, Z.; Wang, Z.; Sun, F.
Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders. Materials 2025, 18, 858.
https://doi.org/10.3390/ma18040858
AMA Style
Lv X, Zhang C, Liu Y, Pan Z, Wang Z, Sun F.
Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders. Materials. 2025; 18(4):858.
https://doi.org/10.3390/ma18040858
Chicago/Turabian Style
Lv, Xiaochun, Chenghao Zhang, Yang Liu, Zhen Pan, Zhiyuan Wang, and Fenglian Sun.
2025. "Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders" Materials 18, no. 4: 858.
https://doi.org/10.3390/ma18040858
APA Style
Lv, X., Zhang, C., Liu, Y., Pan, Z., Wang, Z., & Sun, F.
(2025). Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders. Materials, 18(4), 858.
https://doi.org/10.3390/ma18040858