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Journal: Materials, 2025
Volume: 18
Number: 2478

Article: Coupled Temperature–Flow Field and Microstructure Numerical Simulation of the Solidification Process for Cu-3Ti-0.2Fe Alloy
Authors: by Jiangwei Hu, Qingjuan Wang, Kuaishe Wang, Wen Wang, Fengming Qiang and Longxin Li
Link: https://www.mdpi.com/1996-1944/18/11/2478

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