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Journal: Materials, 2025
Volume: 18
Number: 2379
Article:
Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C
Authors:
by
Chao-Hong Wang and Yue-Han Li
Link:
https://www.mdpi.com/1996-1944/18/10/2379
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