Park, S.; Lee, J.; Lee, S.; Sung, J.; Jung, H.; Lee, H.; Kim, K.
Temperature Uniformity Control of 12-Inch Semiconductor Wafer Chuck Using Double-Wall TPMS in Additive Manufacturing. Materials 2025, 18, 211.
https://doi.org/10.3390/ma18010211
AMA Style
Park S, Lee J, Lee S, Sung J, Jung H, Lee H, Kim K.
Temperature Uniformity Control of 12-Inch Semiconductor Wafer Chuck Using Double-Wall TPMS in Additive Manufacturing. Materials. 2025; 18(1):211.
https://doi.org/10.3390/ma18010211
Chicago/Turabian Style
Park, Sohyun, Jaewook Lee, Seungyeop Lee, Jihyun Sung, Hyungug Jung, Ho Lee, and Kunwoo Kim.
2025. "Temperature Uniformity Control of 12-Inch Semiconductor Wafer Chuck Using Double-Wall TPMS in Additive Manufacturing" Materials 18, no. 1: 211.
https://doi.org/10.3390/ma18010211
APA Style
Park, S., Lee, J., Lee, S., Sung, J., Jung, H., Lee, H., & Kim, K.
(2025). Temperature Uniformity Control of 12-Inch Semiconductor Wafer Chuck Using Double-Wall TPMS in Additive Manufacturing. Materials, 18(1), 211.
https://doi.org/10.3390/ma18010211
