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Journal: Materials, 2025
Volume: 18
Number: 116
116
Article: Study on Quantitative Adjustment of CD Bias and Profile Angle in the Wet Etching of Cu-Based Stacked Electrode
Authors: by Dan Liu, Liang Fang, Zhonghao Huang, Jianguo An, Xu Wu, Fang Wu, Wenxiang Chen and Gaobin Liu
Link: https://www.mdpi.com/1996-1944/18/1/116

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