Article Versions Notes

Liu D, Fang L, Huang Z, An J, Wu X, Wu F, Chen W, Liu G. Study on Quantitative Adjustment of CD Bias and Profile Angle in the Wet Etching of Cu-Based Stacked Electrode. Materials. 2025; 18(1):116. https://doi.org/10.3390/ma18010116

Liu, Dan, Liang Fang, Zhonghao Huang, Jianguo An, Xu Wu, Fang Wu, Wenxiang Chen, and Gaobin Liu. 2025. "Study on Quantitative Adjustment of CD Bias and Profile Angle in the Wet Etching of Cu-Based Stacked Electrode" Materials 18, no. 1: 116. https://doi.org/10.3390/ma18010116

Liu, D., Fang, L., Huang, Z., An, J., Wu, X., Wu, F., Chen, W., & Liu, G. (2025). Study on Quantitative Adjustment of CD Bias and Profile Angle in the Wet Etching of Cu-Based Stacked Electrode. Materials, 18(1), 116. https://doi.org/10.3390/ma18010116