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Journal: Materials, 2024
Volume: 17
Number: 1620

Article: Emerging Non-Noble-Metal Atomic Layer Deposited Copper as Seeds for Electroless Copper Deposition
Authors: by Zihong Gao, Chengli Zhang, Qiang Wang, Guanglong Xu, Guoyou Gan and Hongliang Zhang
Link: https://www.mdpi.com/1996-1944/17/7/1620

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