Simulation Study on Temperature and Stress Fields in Mg-Gd-Y-Zn-Zr Alloy during CMT Additive Manufacturing Process
Abstract
:1. Introduction
2. Experimental Procedure
3. Establishment of Simulation Model
3.1. Finite Element Model
3.2. Combined Heat Source Model
3.3. Thermodynamic Analysis
3.4. Stress Analysis
3.5. The Initial and Boundary Conditions of Simulation
3.6. Thermal Physical Parameters of Materials
- The thermophysical properties of the additive area and the substrate are isotropic;
- There is no spatter during the forming process;
- The metal does not evaporate during the forming process;
- The size of the additive area remains constant at the same wire feeding speed;
- Under different process parameters, the height of the additive area is consistent, and the thickness of each layer is identical.
4. Simulation Conclusions and Experimental Results
4.1. Temperature History
4.2. Residual Stress Distribution
4.3. Experimental Result
5. Conclusions
- (1)
- With the increase in heat input, heat accumulation increases. As a result, the liquid phase life of the molten pool increases, the size of the molten pool increases, the mushy area becomes larger, the heat-affected area becomes larger, and the cooling rate decreases. The greater the wire feeding speed, the greater the heat input, and the lower the welding speed, the lower the heat input. The process parameters with the lowest heat input and the lowest heat accumulation are a wire feeding speed of 8 m/min and a welding speed of 8 mm/s.
- (2)
- The residual stress is mainly concentrated on the outer wall of the additive region and the center of the additive region. The residual stress in the Z direction plays a major role. The stress concentration at the arc-extinguishing point of the substrate is because the number of thermal cycles at the arc-extinguishing point is less than that in other areas, and there is no sufficient release stress to cause stress concentration. Through simulation, it is found that the greater the wire feeding speed, the greater the residual stress. The lower the welding speed, the greater the residual stress. The process parameters with the lowest residual stress are a wire feeding speed of 8 m/min and a welding speed of 8 mm/s.
- (3)
- The grain texture of each layer after additive manufacturing is weak, and the residual stress has no obvious effect on the grain orientation. KAM analysis shows that the residual stress of the 1st layer is the highest, and the residual stress of the 11th layer is higher than that of the 6th layer. This is consistent with the simulation results.
- (4)
- The microhardness of the 1st layer was higher than that of the 11th layer and the 6th layer, which was attributed to the residual stress that affected the dislocation density and, consequently, the microhardness of each layer. The higher dislocation density also enhanced the yield strength and compressive strength of the material. The larger residual stress led to the higher dislocation density, which eventually resulted in the increased microhardness and mechanical properties of the part.
- (5)
- The experimental results show that the new combined heat source is very suitable for the simulation of the temperature field and stress field of Mg-Gd-Y-Zn-Zr alloy fabricated by CMT wire-arc additive manufacturing.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Wire Feeding Speed (m/min) | Voltage (V) | Current (A) |
---|---|---|
8 | 11.3 | 87 |
9 | 11.7 | 93 |
10 | 12 | 100 |
Material | Mg | Gd | Y | Zn | Zr |
---|---|---|---|---|---|
Content (wt%) | Bal. | 9.2 | 3.2 | 2 | 0.4 |
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Zhao, M.; Zhao, Z.; Du, W.; Bai, P.; Huang, Z. Simulation Study on Temperature and Stress Fields in Mg-Gd-Y-Zn-Zr Alloy during CMT Additive Manufacturing Process. Materials 2024, 17, 1199. https://doi.org/10.3390/ma17051199
Zhao M, Zhao Z, Du W, Bai P, Huang Z. Simulation Study on Temperature and Stress Fields in Mg-Gd-Y-Zn-Zr Alloy during CMT Additive Manufacturing Process. Materials. 2024; 17(5):1199. https://doi.org/10.3390/ma17051199
Chicago/Turabian StyleZhao, Mingkun, Zhanyong Zhao, Wenbo Du, Peikang Bai, and Zhiquan Huang. 2024. "Simulation Study on Temperature and Stress Fields in Mg-Gd-Y-Zn-Zr Alloy during CMT Additive Manufacturing Process" Materials 17, no. 5: 1199. https://doi.org/10.3390/ma17051199
APA StyleZhao, M., Zhao, Z., Du, W., Bai, P., & Huang, Z. (2024). Simulation Study on Temperature and Stress Fields in Mg-Gd-Y-Zn-Zr Alloy during CMT Additive Manufacturing Process. Materials, 17(5), 1199. https://doi.org/10.3390/ma17051199