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Journal: Materials, 2024
Volume: 17
Number: 5333
Article:
Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication
Authors:
by
Javier de Prado, Børre Tore Børresen, Victoria Utrilla and Alejandro Ureña
Link:
https://www.mdpi.com/1996-1944/17/21/5333
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