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Journal: Materials, 2024
Volume: 17
Number: 5333

Article: Solid-State Diffusion Bonding of Aluminum to Copper for Bimetallic Anode Fabrication
Authors: by Javier de Prado, Børre Tore Børresen, Victoria Utrilla and Alejandro Ureña
Link: https://www.mdpi.com/1996-1944/17/21/5333

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