Next Article in Journal
Analysis of Geometrical Accuracy and Surface Quality of Threaded and Spline Connections Manufactured Using MEX, MJ and VAT Additive Technologies
Previous Article in Journal
Recent Developments in the Adsorption of Heavy Metal Ions from Aqueous Solutions Using Various Nanomaterials
 
 

Order Article Reprints

Journal: Materials, 2024
Volume: 17
Number: 5142

Article: Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications
Authors: by Moses Gu, Hyunjin Nam, Sehoon Park, Minkyung Shin and Sung-Hoon Choa
Link: https://www.mdpi.com/1996-1944/17/21/5142

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop