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Journal: Materials, 2024
Volume: 17
Number: 5142
Article:
Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications
Authors:
by
Moses Gu, Hyunjin Nam, Sehoon Park, Minkyung Shin and Sung-Hoon Choa
Link:
https://www.mdpi.com/1996-1944/17/21/5142
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