Jiang, T.; Jiang, H.; Wang, W.; Mu, H.; Zhang, Y.; Li, B.
Atomically Dispersed High-Active Site Density Copper Electrocatalyst for the Reduction of Oxygen. Materials 2024, 17, 5030.
https://doi.org/10.3390/ma17205030
AMA Style
Jiang T, Jiang H, Wang W, Mu H, Zhang Y, Li B.
Atomically Dispersed High-Active Site Density Copper Electrocatalyst for the Reduction of Oxygen. Materials. 2024; 17(20):5030.
https://doi.org/10.3390/ma17205030
Chicago/Turabian Style
Jiang, Tao, Hongli Jiang, Weibin Wang, Hao Mu, Ying Zhang, and Bo Li.
2024. "Atomically Dispersed High-Active Site Density Copper Electrocatalyst for the Reduction of Oxygen" Materials 17, no. 20: 5030.
https://doi.org/10.3390/ma17205030
APA Style
Jiang, T., Jiang, H., Wang, W., Mu, H., Zhang, Y., & Li, B.
(2024). Atomically Dispersed High-Active Site Density Copper Electrocatalyst for the Reduction of Oxygen. Materials, 17(20), 5030.
https://doi.org/10.3390/ma17205030