Adler, C.; Morais, P.; Akhavan-Safar, A.; Carbas, R.J.C.; Marques, E.A.S.; Karunamurthy, B.; da Silva, L.F.M.
Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach. Materials 2024, 17, 289.
https://doi.org/10.3390/ma17020289
AMA Style
Adler C, Morais P, Akhavan-Safar A, Carbas RJC, Marques EAS, Karunamurthy B, da Silva LFM.
Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach. Materials. 2024; 17(2):289.
https://doi.org/10.3390/ma17020289
Chicago/Turabian Style
Adler, Caio, Pedro Morais, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy, and Lucas F. M. da Silva.
2024. "Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach" Materials 17, no. 2: 289.
https://doi.org/10.3390/ma17020289
APA Style
Adler, C., Morais, P., Akhavan-Safar, A., Carbas, R. J. C., Marques, E. A. S., Karunamurthy, B., & da Silva, L. F. M.
(2024). Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach. Materials, 17(2), 289.
https://doi.org/10.3390/ma17020289
