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Journal: Materials, 2024
Volume: 17
Number: 3619
Article:
Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding
Authors:
by
Seonghui Han, Sang-Eun Han, Tae-Young Lee, Deok-Gon Han, Young-Bae Park and Sehoon Yoo
Link:
https://www.mdpi.com/1996-1944/17/14/3619
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