Han, S.; Han, S.-E.; Lee, T.-Y.; Han, D.-G.; Park, Y.-B.; Yoo, S.
Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding. Materials 2024, 17, 3619.
https://doi.org/10.3390/ma17143619
AMA Style
Han S, Han S-E, Lee T-Y, Han D-G, Park Y-B, Yoo S.
Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding. Materials. 2024; 17(14):3619.
https://doi.org/10.3390/ma17143619
Chicago/Turabian Style
Han, Seonghui, Sang-Eun Han, Tae-Young Lee, Deok-Gon Han, Young-Bae Park, and Sehoon Yoo.
2024. "Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding" Materials 17, no. 14: 3619.
https://doi.org/10.3390/ma17143619
APA Style
Han, S., Han, S.-E., Lee, T.-Y., Han, D.-G., Park, Y.-B., & Yoo, S.
(2024). Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding. Materials, 17(14), 3619.
https://doi.org/10.3390/ma17143619