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Journal: Materials, 2024
Volume: 17
Number: 3245
Article:
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper
Authors:
by
Tsan-Feng Lu, Yu-Ting Yen, Yuan-Fu Cheng, Pei-Wen Wang and YewChung Sermon Wu
Link:
https://www.mdpi.com/1996-1944/17/13/3245
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