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Journal: Materials, 2024
Volume: 17
Number: 2610

Article: Enhancing Adhesion and Reducing Ohmic Contact through Nickel–Silicon Alloy Seed Layer in Electroplating Ni/Cu/Ag
Authors: by Zhao Wang, Haixia Liu, Daming Chen, Zigang Wang, Kuiyi Wu, Guanggui Cheng, Yu Ding, Zhuohan Zhang, Yifeng Chen, Jifan Gao and Jianning Ding
Link: https://www.mdpi.com/1996-1944/17/11/2610

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