Order Article Reprints

Wang Z, Liu H, Chen D, Wang Z, Wu K, Cheng G, Ding Y, Zhang Z, Chen Y, Gao J, et al. Enhancing Adhesion and Reducing Ohmic Contact through Nickel–Silicon Alloy Seed Layer in Electroplating Ni/Cu/Ag. Materials. 2024; 17(11):2610. https://doi.org/10.3390/ma17112610

Wang, Zhao, Haixia Liu, Daming Chen, Zigang Wang, Kuiyi Wu, Guanggui Cheng, Yu Ding, Zhuohan Zhang, Yifeng Chen, Jifan Gao, and et al. 2024. "Enhancing Adhesion and Reducing Ohmic Contact through Nickel–Silicon Alloy Seed Layer in Electroplating Ni/Cu/Ag" Materials 17, no. 11: 2610. https://doi.org/10.3390/ma17112610

Wang, Z., Liu, H., Chen, D., Wang, Z., Wu, K., Cheng, G., Ding, Y., Zhang, Z., Chen, Y., Gao, J., & Ding, J. (2024). Enhancing Adhesion and Reducing Ohmic Contact through Nickel–Silicon Alloy Seed Layer in Electroplating Ni/Cu/Ag. Materials, 17(11), 2610. https://doi.org/10.3390/ma17112610