Next Article in Journal
Physical Analysis and Mathematical Modeling of the Hydrogen Storage Process in the MmNi4.2Mn0.8 Compound
Next Article in Special Issue
Enhancement of Abnormal Grain Growth by Surface Quenching Treatment to Eliminate Cu–Cu Bonding Interfaces Using (111)-Oriented Nanotwinned Copper
Previous Article in Journal
Predictive Modeling of Vickers Hardness Using Machine Learning Techniques on D2 Steel with Various Treatments
Previous Article in Special Issue
The Dominant Role of Recrystallization and Grain Growth Behaviors in the Simulated Welding Heat-Affected Zone of High-Mn Steel
 
 

Order Article Reprints

Journal: Materials, 2024
Volume: 17
Number: 2236

Article: Effect of Compressive Stress on Copper Bonding Quality and Bonding Mechanisms in Advanced Packaging
Authors: by Tsan-Feng Lu, Ping-Yang Lee and YewChung Sermon Wu
Link: https://www.mdpi.com/1996-1944/17/10/2236

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop