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Journal: Materials, 2023
Volume: 16
Number: 2395

Article: Enhancement of Thermoelectric Performance for CuCl Doped P-Type Cu2Sn0.7Co0.3S3
Authors: by Dong-Liang Shi and Kwok-Ho Lam
Link: https://www.mdpi.com/1996-1944/16/6/2395

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