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Journal: Materials, 2023
Volume: 16
Number: 2395
Article:
Enhancement of Thermoelectric Performance for CuCl Doped P-Type Cu2Sn0.7Co0.3S3
Authors:
by
Dong-Liang Shi and Kwok-Ho Lam
Link:
https://www.mdpi.com/1996-1944/16/6/2395
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