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Journal: Materials, 2023
Volume: 16
Number: 1852
1852
Article: Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
Authors: by Aimi Noorliyana Hashim, Mohd Arif Anuar Mohd Salleh, Muhammad Mahyiddin Ramli, Mohd Mustafa Al Bakri Abdullah, Andrei Victor Sandu, Petrica Vizureanu and Ioan Gabriel Sandu
Link: https://www.mdpi.com/1996-1944/16/5/1852

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