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Journal: Materials, 2023
Volume: 16
Number: 1739
Article:
Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish
Authors:
by
So-Yeon Jun, Jung-Hwan Bang, Min-Su Kim, Deok-Gon Han, Tae-Young Lee and Sehoon Yoo
Link:
https://www.mdpi.com/1996-1944/16/4/1739
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