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Journal: Materials, 2023
Volume: 16
Number: 7491

Article: Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging
Authors: by Hsien-Chie Cheng and Wen-You Jhu
Link: https://www.mdpi.com/1996-1944/16/23/7491

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