Next Article in Journal
Technological Aspects of Manufacturing and Control of Gears—Review
Previous Article in Journal
Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface
 
 
Communication

Article Versions Notes

Materials 2023, 16(23), 7451; https://doi.org/10.3390/ma16237451
Action Date Notes Link
article xml file uploaded 30 November 2023 10:13 CET Original file -
article xml uploaded. 30 November 2023 10:13 CET Update https://www.mdpi.com/1996-1944/16/23/7451/xml
article pdf uploaded. 30 November 2023 10:13 CET Version of Record https://www.mdpi.com/1996-1944/16/23/7451/pdf
article html file updated 30 November 2023 10:15 CET Original file -
article html file updated 23 August 2025 01:52 CEST Update -
article html file updated 12 September 2025 09:43 CEST Update https://www.mdpi.com/1996-1944/16/23/7451/html
Back to TopTop