Order Article Reprints
Journal: Materials, 2023
Volume: 16
Number: 5822
Article:
Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures
Authors:
by
Shih-Chi Yang, Dinh-Phuc Tran and Chih Chen
Link:
https://www.mdpi.com/1996-1944/16/17/5822
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.