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Journal: Materials, 2023
Volume: 16
Number: 4808

Article: Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages
Authors: by Giuseppe Mirone, Raffaele Barbagallo, Giuseppe Bua and Guido La Rosa
Link: https://www.mdpi.com/1996-1944/16/13/4808

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