Liu, G.; Wang, J.; Chen, B.; Guo, B.; Zhang, H.; Wang, Z.
Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites. Materials 2023, 16, 4761.
https://doi.org/10.3390/ma16134761
AMA Style
Liu G, Wang J, Chen B, Guo B, Zhang H, Wang Z.
Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites. Materials. 2023; 16(13):4761.
https://doi.org/10.3390/ma16134761
Chicago/Turabian Style
Liu, Guoyue, Jian Wang, Bing Chen, Bing Guo, Hua Zhang, and Zhaohui Wang.
2023. "Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites" Materials 16, no. 13: 4761.
https://doi.org/10.3390/ma16134761
APA Style
Liu, G., Wang, J., Chen, B., Guo, B., Zhang, H., & Wang, Z.
(2023). Parameters Optimization of Laser-Grinding Chain for Processing Groove of 2.5-Dimensional C/SiC Composites. Materials, 16(13), 4761.
https://doi.org/10.3390/ma16134761