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Journal: Materials, 2023
Volume: 16
Number: 4614

Article: Research Progress of Electroplated Nanotwinned Copper in Microelectronic Packaging
Authors: by Ke-Xin Chen, Li-Yin Gao, Zhe Li, Rong Sun and Zhi-Quan Liu
Link: https://www.mdpi.com/1996-1944/16/13/4614

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