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Journal: Materials, 2023
Volume: 16
Number: 4291

Article: Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions
Authors: by Meng-Kai Shih, Yu-Hao Liu, Calvin Lee and C. P. Hung
Link: https://www.mdpi.com/1996-1944/16/12/4291

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