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Journal: Materials, 2022
Volume: 15
Number: 2679
2679
Article: Potential of Commercial Wood-Based Materials as PCB Substrate
Authors: by Kirsi Immonen, Johanna Lyytikäinen, Janne Keränen, Kim Eiroma, Mika Suhonen, Minna Vikman, Ville Leminen, Marja Välimäki and Liisa Hakola
Link: https://www.mdpi.com/1996-1944/15/7/2679

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