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Journal: Materials, 2022
Volume: 15
Number: 2354
2354
Article: Leaching of Copper Contained in Waste Printed Circuit Boards, Using the Thiosulfate—Oxygen System: A Kinetic Approach
Authors: by Eleazar Salinas-Rodríguez, Juan Hernández-Ávila, Eduardo Cerecedo-Sáenz, Alberto Arenas-Flores, Maria A. Veloz-Rodríguez, Norman Toro, Maria del P. Gutiérrez-Amador and Otilio A. Acevedo-Sandoval
Link: https://www.mdpi.com/1996-1944/15/7/2354

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