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Thermal Cloak: Theory, Experiment and Application
 
 

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Journal: Materials, 2022
Volume: 15
Number: 935

Article: Nanoscale Thermal Cloaking in Silicon Film: A Molecular Dynamic Study
Authors: by Jian Zhang, Haochun Zhang, Wenbo Sun, Qi Wang and Dong Zhang
Link: https://www.mdpi.com/1996-1944/15/3/935

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