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Journal: Materials, 2022
Volume: 15
Number: 7783
Article:
Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration
Authors:
by
Po-Yu Kung, Wei-Lun Huang, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung and C. R. Kao
Link:
https://www.mdpi.com/1996-1944/15/21/7783
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